3D IC has the advantages of high density, low power
loss and high performance; it utilizes three-dimensional stack architecture to
meet the future demand for compact and slim electronic products, and continues
Moore's Law of the semiconductor industry.
As Taiwan possesses the complete vertical supply
chain for semiconductors, the country is suitable for developing
three-dimensional stacking technology products, and is helpful in the
integration of the semiconductor industry and technology rooting.
This report provides an overview of the worldwide 3D
IC market, touching on major application and regional markets, and major
vendors of 3D IC key components in Taiwan.
Browse Full Report With TOC @ http://www.radiantinsights.com/research/the-worldwide-3d-ic-market-and-major-supply-chain-players-in-taiwan
List of Topics
Overview of the worldwide 3D IC market, touching on
the major development trends and market value by application and by region
Profile of major Taiwanese 3D IC equipment vendors
across the supply chain, including an overview of technology and vendors'
deployment at various segments of the supply chain, such as photolithography,
dry etching, wet etching, coating, bonding, packaging and testing
Table of Contents
1. Worldwide 3D IC Market
1.1 Application Sectors
1.1.1 Consumer Electronics
1.1.2 ICT
1.1.3 Transportation (Automobiles and Aerospace)
1.1.4 Military
1.1.5 Others (Biomedical applications and R&D)
1.2 Regional Markets
1.2.1 North America
1.2.2 Europe
1.2.3 Asia Pacific
1.2.4 Rest of the World
1.3 Summary of the Worldwide 3D IC Market
List of Figures
Figure 1: Worldwide 3D IC Market Value Contributed
by Consumer Electronics Sector
Figure 2: Worldwide 3D IC Market Value Contributed
by ICT Sector
Figure 3: Worldwide 3D IC Market Value Contributed
by Transportation Sector
Figure 4: Worldwide 3D IC Market Value Contributed
by Military Sector
Figure 5: Worldwide 3D IC Market Value Contributed
by Other Sectors
Figure 6: Worldwide 3D IC Market in 2012 and 2019 by
Application Market
Figure 7: Taiwanese 3D IC Equipment Supply Chain
Figure 8: Temporary Bonding
Figure 9: Laser De-bonding
Figure 10: Illustration of CoWoS
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